TSP
By: TEKNOSEAL ENGINEERING SOLUTIONS
associated with 0 other trademarks
sealant compounds for joints

Words that describe this trademark:

insulating materials  materials  sealant  compounds  packing  joints  stopping 

Serial Number:

88157985

Mark:

TSP

Status:

Registered

Status Date:

01-25-2022

Filing Date:

Registration Number:

6629506

Registration Date:

01-25-2022

Goods and Services:

sealant compounds for joints

Mark Description:

N/A

Class:

Rubber

Type of Mark:

Trademark

Published for Opposition Date:

09-22-2020

Owner:

Mark Drawing Status:

Standart Character Mark

Abandon Date:

N/A

Business Name:

WILEY REIN, LLP

Correspondent Name:

Recent Trademark filings by this company