TRUEBUMP
associated with 76 other trademarks
Computer software for determining and assessing characteristics of 3D structures, such as bumps, pillars, pads, balls and vias on the aforementioned s...

Words that describe this trademark:

inspection equipment  semiconductor wafers  devices  semiconductor  wafers  characterizing  inspecting  equipment  die  substrates 

Serial Number:

87567438

Mark:

TRUEBUMP

Status:

Registered

Status Date:

10-15-2019

Filing Date:

Registration Number:

5885889

Registration Date:

10-15-2019

Goods and Services:

Computer software for determining and assessing characteristics of 3D structures, such as bumps, pillars, pads, balls and vias on the aforementioned substrates including position, height, dimensions, and co-planarity

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

02-12-2019

Mark Drawing Status:

4

Abandon Date:

N/A

Business Name:

P.O. BOX 2910

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