Serial Number:
76188063
Mark:
THERMAL MANAGEMENT SUBSTRATE
Status:
Abandoned-Failure to Respond
Status Date:
06-05-2002
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
Printed circuit board adapted for use as a heat dissipating laminate Mass lamination of thermal printed circuit board laminates for others
Mark Description:
N/A
Class:
Treatment of materials.
Type of Mark:
Trademark
Published for Opposition Date:
N/A
Owner:
Mark Drawing Status:
Typed Drawing
Abandon Date:
04-10-2002
Business Name:
N/A
Correspondent Name:
