Mark:

TDK-EPC

Status Date:

11-17-2014

Registration Number:

N/A

Goods and Services:

Semiconductor manufacturing machines, namely, wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers; slice wafer carbon demounting and cleaning machine, wafer edge grinding machine, dicing machines, and chemical mechanical planarizers and machine component parts therefor; insertion mount machines used to insert the leads of electronic components through holes in printed circuit boards; bulk feeder machines used to line up bulk electronic components and feed them into a mounter machine; automatic sequencer machines for printed circuit board assembly; SMT (surface mount technology) placement machines used to place surface-mount electronic devices onto a printed circuit board; flip chip mounting machine for the manufacture of electric, electronic and semiconductor devices and components; component inserting machines for the manufacture of electric, electronic and semiconductor devices and components; bulk feeding machines; machines for laser marking, used for the manufacture of electric, electronic and semiconductor devices and components; pumps as part of machines apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; blank magnetic data carriers, blank recording discs; cash registers, calculating machines, data processing equipment and computers; fire-extinguishing apparatus; ceramic components, namely, thermistors, varistors, LTCC (lot-temperature cofired ceramics) modules not intended for use in computers, piezo electronic components, surge voltage arresters, switching spark gaps and microwaves ceramics; ceramic materials used for microwave components; capacitors; ceramic capacitors; multilayer ceramic capacitors; EMC (electromagnetic compatibility) components, namely, capacitors, inductors, chip beads, varistors, filters, common mode filters, electromagnetic shield materials; chip beads, namely, a chip type EMC (electromagnetic compatibility) countermeasure component that absorbs a high-frequency component contained in a signal and converts into heat using the properties of ferrite; filters for electrical signals; filters to control signal frequencies; filters for radio interference suppression; EMC (electromagnetic compatibility) filters; 3-terminal filters which are EMC (electromagnetic compatibility) countermeasure components that internally combine an inductor and a capacitor and have three terminals, namely, an input, an output and a ground; electric choke coils which act as inductances that isolate AC frequency currents from certain areas of a radio circuit; common mode electric choke coils which are used to prevent electromagnetic interference (EMI) and radio frequency interference (RFI) from power supply lines and to prevent the malfunctioning of electric equipment by passing differential currents while block common-mode currents; differential mode electric choke coils; peaking electric coils; electric molded coils; varistors; clamp filters in the nature of ferrite cores with case to be mounted to a cable to remove electric noise; ferrites, namely, an oxide group magnetic material blending and sintering manganese, nickel, zinc, etc. to iron oxide; ferrite cores, namely, electric and electronic cores made from ferrites; dielectric filters, namely, a type of electric filter formed from a dielectric material with an internal conductor and a type of electronic filter formed from a dielectric material with an internal conductor; ceramic filters, namely, a type of electric filter formed from ceramic materials and a type of electronic filter formed from ceramic materials; piezoelectric filters, namely, a type of electric filter formed from piezoelectric materials and a type of electronic filter formed from piezoelectric materials; ferrite beads filters, namely, a passive electronic component used to suppress high frequency noise in electronic circuits; noise filters, namely, an electric/electronic component used to suppress electric noise; electric inductors and electronic inductors; coil-type inductors with the lead wire in the shape of a coil; transformers; electric transformers, electronic transformers; pulse transformers; current transformers; noise suppressing sheets made from a material such as ferrite and carbon that absorbs electromagnetic energy in radio waves and changes such energy into heat; magnetic sheets made from a material such as ferrite and carbon that absorbs electromagnetic energy in radio waves and changes such energy to heat; electro-magnetic absorbing and shielding materials, namely, ferrite and carbon that absorbs electromagnetic energy in radio waves and changes such energy to heat; micro wave absorbers made from ferrite and carbon and base materials such as a styrene foam, a foaming polyethylene, and an inorganic material that absorbs microwaves; electromagnetic absorbers, made from ferrite and carbon and base materials such as a styrene foam, a foaming polyethylene, and an inorganic material that absorbs electromagnetic energy in radio waves; radio wave absorbers made from ferrite and carbon and base materials such as a styrene foam, a foaming polyethylene, and an inorganic material, that absorbs radio waves; high frequency magnetic substances, namely, magnetic materials, namely, ferrites, used for high frequency components; anechoic chambers where external electromagnetic waves are blocked and the interior is electromagnetically stabilized, which are used to measure noise emitted from electronic devices, and examine the resistance of electronic devices to electromagnetic devices; equipments and devices for EMC (electro magnetic compatibility) test system, sold individually or in units, namely, monitoring cameras, camera controllers, remote switch modules not intended for use in computers, control panels, transmitters, receivers, network interface devices, 3-dimensional manipulators, antenna positioning devices, field probe positioners, horn positioners, manual vertical masts, adjustable tripods, field probe stand, video camera stands, camera wall mounts, test benches and test tables; electric sensors, electronic sensors; temperature measurement sensors; thermistors; NTC (negative temperature coefficient) thermistors; PTC (positive temperature coefficient) thermistors; temperature responsive reed switches comprised of a temperature sensor with a contact combining a small ferrite magnet, a temperature-responsive ferrite, and a lead relay; electric humidity sensors, electronic humidity sensors; surface potential sensors to measure surface electrical potential of a drum or paper in copiers or printers; gear tooth sensors to measure a rotation angle of a cam crank; gear tooth sensors for angle sensing in response to the need of automobiles; gear tooth sensors for speed sensing in response to the need of automobiles; toner concentration and residual volume sensors for printers; powder level sensors for printers; door open and shut electronic sensors; electric switches for door latch, electronic switches for door latch; electromagnetic sensors; electric actuators, electronic actuators; plungers and plunger parts of machines, namely, electromagnetic plunger solenoids that are used as mechanical drive components for applications such as portable audio equipment, cameras, CD-ROM and DVD-ROM drive; piezoelectronic components, namely, piezoelectric filters, receivers, buzzers, actuators, resonators, sensors and pulse-height discriminators for sensing a pulse signal above a user-prescribed level; piezoelectronic ceramic filters, namely, electric and electronic filters made of piezoelectronic ceramic materials that generate electrical voltage in response to applied mechanical stress and that change shape when electrical voltage is applied; resonators; resonant electric circuits, resonant electronic circuits; ceramic electronic resonators, ceramic electronic resonators; ceramic resonators; sounding bodies, namely, a sound converter that emits an alarm and a melody; piezoelectric receivers; piezoelectric buzzers; electromagnetic buzzers; piezoelectronic actuators; electric magnetostrictive resonators, electronic magnetostrictive resonators; pulse-height discriminators, namely, discriminators that sense a pulse signal above a prescribed level; thermal print heads for printers; thin film thermal print heads for printers; recording and reproducing magnetic heads, recording and reproducing thermal heads, recording and reproducing optical heads; magnetic heads for reading and reproducing data; thin film magnetic heads for reading and reproducing data; CF (compact flash) memory cards; CF (compact flash) memory card for industrial applications; displays for home electronics applications, commercial applications, in-car applications, mobile applications and industrial applications; organic light emitting diode (OLED) displays; light emitting diodes; organic light emitting diodes; RF(radio frequency) components, namely, filters, isolators, duplexers and couplers; antennas; ceramic patch antennas; multilayer chip antennas; band pass filters, namely, devices that pass frequencies within a certain range and reject frequencies outside of that range; band pass filters formed from dielectric materials; circulators; circulators for base stations; isolators whose function is to isolate and remove adverse current to protect circuits and stabilize their operation; isolators whose function is to isolate and remove adverse current to protect circuits and stabilize their operation,for base stations; multiplexers; diplexers used in dual band cellular telephones to enable such devices to use cellular service through two or more systems; diplexers in the form of multilayers; band pass filters in the form of multilayers; thin-Film laminated band pass filters; phase shifters, namely, components that convey data by changing, or modulating, the phase of a reference signal (the carrier wave); phase shifters, namely, electronic circuits that convey data by changing, or modulating, the phase of a reference signal (the carrier wave) in the form of multilayers; delay lines, namely, a device where the input signal reaches the output of the device after a known period of time has elapsed; strip line, namely, a transverse electromagnetic transmission line medium used to produce high electric fields over a controlled bandwidth to perform EMC measurements of automobiles and aircraft; low pass filters, namely, filters that pass low-frequency signals but attenuate, reduce the amplitude of, signals with frequencies higher than the cutoff frequency; low pass filters in the form of multilayers; high pass filters, namely, filters that pass high-frequency signals but attenuate signals with frequencies higher than the cutoff frequency; high pass filters in the form of multilayers; baluns; balun transformers; multilayer balun transformers; thin film balun transformers; couplers, namely, components that control the output gains of transmission amplifiers automatically by feeding some outputs back in transmission circuits of wireless communication devices; directional electrical signal couplers; multilayer directional electrical signal couplers; devices for wireless radio transmission; wireless telephony apparatus; electric resisters, electronic resisters; double balance mixers, namely, components that pass only a small leakage of the original signal to the out, often implemented as a double balanced mixer which has high isolation of both inputs; terminators, namely, electric and electronic components which are put at the end of a wire or cable to prevent RF signals being reflected back from the end; electric transducers, electronic transducers; accelerometers; electrodes; magnets; ferrite magnets; plastic bonded magnets; rubber bonded magnets; magnetic sheets; magnetic cores; magnetic materials, namely, magnets; power supplies; AC (alternate current) input power supplies; DC (direct current) to DC (direct current) converters; DC (direct current) to AC (alternate current) inverters; switching power supplies; noise filters, namely, electric and electronic components to suppress electric noise; UPS (uninterruptible power systems), namely, a device that backs up systems by supplying power instantly when power stops due to power failures; inverters; inverter ballasts; fluorescent lamp ballast for electric lights; converters; FOUP Load Port, namely, station for supporting a wafer transporting container where the cover of the transporting containers is separated or separable from the transporting container; flip chip dispensers for the manufacture of electric, electronic and semiconductor devices and components; IC, namely, integrated circuits; blank magnetic tapes; blank magnetic discs; blank magnetic optical disks; blank optical disks; SAW (Surface Acoustic Wave) components, namely, SAW (Surface Acoustic Wave) resonators, namely, electric and electronic components which oscillate a clock signal which drives an integrated circuit with a certain constant frequency, SAW (Surface Acoustic Wave) filters for interference suppression of electrical fault clearance for use in the fields of industry of electronics, telecommunications, medical technology, consumer electronics, household appliances, data processing, building services engineering and traffic engineering, SAW (Surface Acoustic Wave) duplexers used to share reception and transmission of signals via one antenna in cellular telephones; duplexers; RF (radio frequency) modules not intended for use in computers; SAW (surface acoustic wave) modules not intended for use in computers; SAW (surface acoustic wave) fronted modules not intended for use in computers; diodes; arrestors, namely, lightning arrestors; surge arresters; surge voltage arrestors; ceramic electric switching components; ceramic electronic switching components; switching spark gaps, namely, an arrangement of two conducting electrodes separated by a gap usually filled with a gas such as air, designed to allow an electric spark to pass between the conductors when the voltage difference between the conductors exceeds the gap's breakdown voltage; electric filters for conversion; power capacitors; tantalum chip capacitors; aluminum electrolytic capacitors; inductive ferrite components; film capacitors; polymer chip capacitors; accessories for mounting ferrite cores, namely, bobbins, springs, yokes, clips, clamps, bands, cases, covers, electrical feed connectors, magnetostrictive vibrators, bias magnets, trimmers and flanges; SMT (surface mount technology) inductive resistors; SMT (surface mount technology) power inductive resistors; repeating electric coils; EMC (electromagnetic compatibility) filters for shielded rooms to suppress electromagnetic interference; EMC (electro magnetic compatibility) feedthrough components, namely, capacitors, inductors, varistors, ; ceramic semiconductors; microwave band pass filters; microwave resonators; dielectric ceramic filters for filtering electrical and/or electronic signals; electric and electronic high-frequency modules not intended for use in computers; electric and electronic modules not intended for use in computers to control microwave radio signals; integrated electric and electronic modules not intended for use in computers utilizing LTCC (low-temperature cofired ceramics) technology; BAW (bulk acoustic wave) components, namely, filters and duplexers; FBAR (film bulk acoustic wave)components, namely, bulk acoustic resonators, bulk acoustic filters, bulk acoustic duplexers, bulk acoustic sensors; MEMS (micro electro mechanical systems) components, namely, devices that incorporate multi-layered actuators and sensors on a substrate; MEMS (micro electro mechanical systems) sensors, namely, pressure sensors; Surface acoustic wave fronted modules for mobile communications and not intended for use in computers; electronic circuit modules not intended for use in computers; H-ML (high-frequency multilayer) devices, namely, components and devices used in high-frequency circuits of communication devices such as cellular telephones; ESD (electro-static discharge) components, namely, electric and electronic components for protecting electronic circuits from ESD (electro static discharge) problems; EMI (electro-magnetic interference) components, namely, choke coils, clamp filters, line filters; PLC, namely, planar lightwave circuits; electronic and optical communications instruments and components, namely, transmitter optical subassembly (TOSA); electronic and optical communications instruments and components, namely, receiver optical subassembly (ROSA); optical sensors; visible radiant optical sensors; optical attenuators; optical couplers; electronic and optical communications instruments and components, namely, optical splitters; optical filters; optical switches; electronic and optical communications instruments and components, namely, optical isolators, optical circulators, optical modulators and optical connectors; optical multiplexers; optical demultiplexers; electronic and optical communications instruments and components, namely, optical transceivers; photo diodes; optical sensor modules not intended for use in computers; visible radiant optical sensor modules not intended for use in computers; optical attenuator modules not intended for use in computers; optical coupler modules not intended for use in computers; electronic and optical communications instruments and components, namely, optical splitter modules not intended for use in computers; optical filter modules not intended for use in computers; optical switch modules not intended for use in computers; optical isolator modules not intended for use in computers; optical circulator modules not intended for use in computers; electronic and optical communications instruments and components, namely, faraday rotator modules not intended for use in computers; optical modulator modules not intended for use in computers; optical connector modules not intended for use in computers; optical multiplexer modules not intended for use in computers; optical demultiplexer modules not intended for use in computers; optical transceiver modules not intended for use in computers; photo diode modules not intended for use in computers; optical sensor assemblies for optical sensing; visible radiant optical sensor assemblies for optical sensing; electronic and optical communications instruments and components, namely, optical attenuator assemblies, optical coupler assemblies, optical splitter assemblies, optical filter assemblies; optical switch assemblies, optical isolator assemblies, optical circulator assemblies, faraday rotator assemblies, optical modulator assemblies, optical connector assemblies, optical multiplexer assemblies, optical demultiplexer assemblies, optical transceiver assemblies, photo diode assemblies, transmitter optical sub assemblies, receiver optical sub assemblies, and faraday rotators; multilayer varistors; multilayer NTC (negative temperature coefficient) thermistors; and parts therefor nebulizers; nebulizer units; ultrasonic nebulizer units humidifier for mist generation system dielectric materials, namely, an insulator that does not conduct current

Class:

Rubber

Published for Opposition Date:

08-16-2011

Mark Drawing Status:

Words, Letters, and/or Numbers in Stylized From

Business Name:

BAKER & HOSTETLER LLP