Serial Number:
75515057
Mark:
SNAP-LID
Status:
Cancelled-Section 8
Status Date:
07-08-2006
Filing Date:
Registration Number:
2281260
Registration Date:
09-28-1999
Protective covers and lids have been pre-applied with fast bonding or curing adhesive preforms, for use in place of encapsulant and molding compound used for protection of semiconductor, electronic modules
Mark Description:
N/A
Class:
Scientific
Type of Mark:
Trademark
Published for Opposition Date:
07-06-1999
Mark Drawing Status:
Typed Drawing
Abandon Date:
N/A
Business Name:
N/A
Correspondent Name:
