RECON
associated with 125 other trademarks
Integrated circuit packages for semiconductors, namely, ball grid array and land grid array chip packages consisting of supporting boards on which bal...

Words that describe this trademark:

land grid array  integrated circuit packages  ball grid array  grid array  array chip  circuit  packages  array  semiconductors 

Serial Number:

85356053

Mark:

RECON

Status:

Cancelled-Section 8

Status Date:

05-10-2019

Filing Date:

Registration Number:

4222847

Registration Date:

10-09-2012

Goods and Services:

Integrated circuit packages for semiconductors, namely, ball grid array and land grid array chip packages consisting of supporting boards on which balls are gridded array; substrates for semiconductors, namely, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or embedded; ball grid array and land grid array chip packages, namely, supporting boards on which balls are gridded arrayed; conductive substrate for flexible printed circuit board; electronic components, namely, resistor networks in a ball grid array and land grid array package

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

11-08-2011

Mark Drawing Status:

Standart Character Mark

Abandon Date:

N/A

Business Name:

KNOBBE MARTENS OLSON & BEAR LLP

Correspondent Name:

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