POWERSOP
By: AMKOR TECHNOLOGY, INC.
associated with 39 other trademarks
SEMICONDUCTOR PACKAGING INCORPORATING HEAT DISSIPATION STRUCTURES

Words that describe this trademark:

heat dissipation  semiconductor packaging  structures  incorporating  dissipation  packaging 

Serial Number:

75714446

Mark:

POWERSOP

Status:

Renewed

Status Date:

06-23-2022

Filing Date:

Registration Number:

2528886

Registration Date:

01-15-2002

Goods and Services:

SEMICONDUCTOR PACKAGING INCORPORATING HEAT DISSIPATION STRUCTURES

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

10-24-2000

Owner:

Mark Drawing Status:

Typed Drawing

Abandon Date:

N/A

Business Name:

MCANDREWS, HELD & MALLOY, LTD.

Correspondent Name:

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