Mark:

Status Date:

09-12-2023

Registration Number:

4309594

Goods and Services:

blank magnetic data carriers, blank recording discs; automatic vending machines and mechanisms for coin-operated apparatus cash registers; calculating machines, data processors fire-extinguishing apparatus; ceramic components, namely, thermistors, varistors, LTCC (low-temperature cofired ceramics) modules, piezo electronic components, surge voltage arresters, switching spark gaps and microwave ceramics; ceramic materials used for microwave components; capacitors; ceramic capacitors; multilayer ceramic capacitors; EMC (electromagnetic compatibility) components, namely, capacitors, inductors, chip beads, varistors, and electromagnetic shield materials; chip beads, namely, a chip type EMC (electromagnetic compatibility) countermeasure component that absorbs a high-frequency component contained in a signal and converts into heat using the properties of ferrite; filters for electrical signals; filters to control signal frequencies; filters for radio interference suppression; EMC (electromagnetic compatibility) filters used for filtering electrical signals; 3-terminal filters, comprised of an input, an output and a ground, in which an inductor and a capacitor are used for the filtering of EMC (electromagnetic compatibility) problems; common mode filters used for absorbing and removing common mode noise; choke coils; common mode choke coils which are used to prevent electromagnetic interference (EMI) and radio frequency interference (RFI) from power supply lines and to prevent the malfunctioning of electric equipment by passing differential currents while blocking common mode currents; differential mode electric choke coils; peaking electric coils; electric molded coils; varistors; clamp filters in the nature of ferrite cores with cases, to be mounted around a cable to remove electric noise; ferrites, namely, an oxide group magnetic material blending and sintering manganese, nickel, zinc, and iron oxide; ferrite cores; dielectric filters, namely, a type of electric filter formed from a dielectric material with an internal conductor, a type of electronic filter formed from a dielectric material with an internal conductors; dielectric filters, namely, a type of electronic filter formed from a dielectric material with an internal conductor; ceramic filters, namely, a type of electric filter formed from ceramic materials, a type of electronic filter formed from ceramic materials; ceramic filters, namely, a type of electronic filter formed from ceramic materials; piezoelectric filters, namely, a type of electric filter formed from piezoelectric materials; piezoelectric filters, namely, a type of electronic filter formed from piezoelectric materials; ferrite beads filters, namely, a passive electric component used to suppress high frequency noise in electronic circuits; noise filters; electric inductors and electronic inductors; coil-type inductors with the lead wire in the shape of a coil; transformers; electrical/electronic transformers; pulse transformers; current transformers; noise suppressing sheets made from a material such as ferrite and carbon that absorbs electromagnetic energy in radio waves and changes such energy into heat; magnetic sheets made from a material such as ferrite and carbon that absorbs electromagnetic energy in radio waves and changes it into heat; electro-magnetic absorbing and shielding materials, namely, ferrite and carbon that absorbs electromagnetic energy in radio waves and changes such energy to heat; micro wave absorbers made from ferrite and carbon and base materials such as a styrene foam, a foaming polyethylene, and an inorganic material that absorbs microwaves; electromagnetic absorbers made from ferrite and carbon and base materials such as a styrene foam, a foaming polyethylene, and an inorganic material that absorbs electromagnetic energy in radio waves; radio wave absorbers made from ferrite and carbon and base materials such as a styrene foam, a foaming polyethylene, and an inorganic materials, that absorbs radio waves; high frequency magnetic substances, namely, ferrites, used for high frequency components; anechoic chambers where external electromagnetic waves are blocked and the interior is electromagnetically stabilized, which are used to measure noise emitted from electronic devices, and examine the resistance of electronic devices to electromagnetic devices; equipments/devices for EMC (electro magnetic compatibility) test system, sold individually or in units, namely, monitoring cameras, camera controllers, remote switch modules, control panels, computer software, computer programs, transmitters, receivers, network interface devices, 3-dimensional manipulators, antenna positioning devices, field probe positioners, horn positioners, manual vertical masts, adjustable tripods, field probe stands, video camera stands, camera wall mounts, test benches and test tables; electronic sensors, temperature measurement sensors; thermistors; NTC (negative temperature coefficient) thermistors; PTC (positive temperature coefficient) thermistors; temperature responsive reed switches; humidity sensors; surface potential sensors to measure the surface electrical potential of a drum or paper in copiers or printers; gear tooth sensors to measure a rotation angle of a cam crank; gear tooth sensors used in automobiles for angle sensing; gear tooth sensors used in automobiles for speed sensing; toner concentration and residual volume sensors for printers; powder level sensors for printers; door open and shut electronic sensors; electric switches for door latch, electronic switches for door latch; electromagnetic sensors; actuators; plungers, namely, electromagnetic plunger solenoids that are used as mechanical drive components for applications such as portable audio equipment, cameras, CD-ROM and DVD-ROM drives; plunger parts of machines, namely, electromagnetic plunger solenoids that are used as mechanical drive components for applications such as portable audio equipment, cameras, CD-ROM and DVD-ROM drives; piezoelectric components, namely, piezoelectric filters, receivers, buzzers, actuators, resonators, sensors, nebulizers, ultrasonic nebulizer units and pulse-height discriminators for sensing a pulse signal above a user-prescribed level; piezoelectric ceramic filters, namely, electric and electronic filters made of piezoelectric ceramic materials that generate electrical voltage in response to applied mechanical stress and that change shape when electrical voltage is applied; resonators, namely, an electric and electronic component which oscillates a clock signal which drives an integrated circuit with a certain constant frequency; resonant electric circuits, resonant electronic circuits,; ceramic electric resonators, ceramic electronic resonators; sounding bodies, namely, a sound converter that emits an alarm and a melody; piezoelectric receivers; piezoelectric buzzers; electromagnetic buzzers; piezoelectric actuators; electric magnetostrictive resonators, electronic magnetostrictive resonators; discriminators; ceramic pulse height discriminators for sensing a pulse signal above a prescribed level; thermal print heads for printers; thin film thermal print heads for printers; recording and reproducing magnetic heads, recording and reproducing thermal heads, recording and reproducing optical heads; magnetic heads for reading and reproducing data; thin film magnetic heads for reading and reproducing data; memory controllers, namely, a digital circuit which manages the flow of data going to and from the main flash memory; non-volatile memory controllers; flash memory controllers; NAND-type flash memory controllers, namely, a digital circuit which manages the flow of data going to and from the main NAND-type flash memory; flash memory data storage chips; memory cards; flash memory cards; non-volatile memory data storage chips; non-volatile memory cards; CF (compact flash) cards; CF (compact flash) card for industrial applications; SSD (solid state drive); SSD (solid state drive) for industrial applications; semiconductor devices; semiconductor memories; memory card adapters; electronic display apparatus for home electronics applications, commercial applications, in-car applications, mobile applications and industrial applications; organic light emitting displays for home electronics applications, commercial applications, in-car applications, mobile applications, and industrial applications; light emitting diodes; organic light emitting diodes, which are light-emitting diodes [ (LEOS) ] * (LEDs) * whose emissive electroluminescent layers are composed of a film of organic compounds; RF (radio frequency) components, namely, filters, isolators, duplexers and couplers; antennas; ceramic patch antennas; ceramic chip antennas; multilayer chip antennas; band pass filters, namely, electronic filters that pass frequencies within a certain ranges and reject frequencies outside that range; band pass filters formed from dielectric materials; circulators; circulators for base stations; isolators whose function is to isolate and remove adverse current to protect circuits and stabilize their operation; isolators whose function is to isolate and remove adverse current to protect circuits and stabilize their operation, for base stations; multiplexers; diplexers; multilayer diplexers; band pass filters in a multilayer form; thin-film laminated band pass filters; phase shifters, namely, electronic components that convey data by changing, or modulating, the phase of a reference signal (the carrier wave); phase shifters in a multilayer form; delay lines, namely, electronic components that delay the output of an input signal; strip lines, namely, an electromagnetic transmission line medium consisting of flat metal-strip center conductors which are separated from flat metal-strip outer conductors by dielectric strips; low pass filters, namely, filters that pass low-frequency signals but attenuate and reduce the amplitude of signals with frequencies higher than the filters' cutoff frequency; low pass filters in a multilayer form; high pass filters, namely, filters that pass high-frequency signals but attenuate signals with frequencies higher than the filters' cutoff frequency; high pass filters in a multilayer form; baluns; balun transformers; multilayer balun transformers; thin film balun transformers; couplers, namely, electronic components that control the output gains of transmission amplifiers automatically by feeding some outputs bak in transmission circuits of wireless communication devices; directional electrical signal couplers; multilayer directional electrical signal couplers; wireless LAN (local area network) modules; electric resisters, electronic resisters; double balance mixers, namely, electronic components that pass only a small leakage of the original signal to the output, often implemented as a double balanced mixer which has high isolation of both inputs; terminators, namely, electric and electronic components * which are put at the end of a wire or cable * to prevent RF signals being reflected back from the end, causing interference; ; electric transducers, electronic transducers; accelerometers; electrodes; magnets; ferrite magnets; plastic bonded magnets; rubber bonded magnets; magnets sheets; magnetic cores; magnetic materials, namely, magnets; power supplies; AC (alternate current) input power supplies; DC (direct current) to DC (direct current) converters; DC (direct current) to AC (alternate current) inverters; switching power supplies; UPS (uninterruptible power systems), namely, a device that backs up systems by supplying power instantly when power stops due to power failures; solar cells; film solar cells; inverters; inverter ballasts; fluorescent lamp ballast for electric lights; converters; semiconductor wafer processing equipment; semiconductor manufacturing machines, namely, wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers; FOUP Load Port, namely, a station for supporting a semiconductor wafer transporting container where the cover of the transporting container is separated or separable from the transporting container; flip chip dispensers for the manufacture of electric, electronic and semiconductor devices and components; bulk feeding machines for the manufacture of electric, electronic and semiconductor devices and components; machines for laser marking, used for the manufacture of electric, electronic and semiconductor devices and components; IC (integrated circuits); circuit boards; IC (integrated circuits) boards; batteries; ITO (Indium-Tin-Oxide) film, namely, a transparent electric conduction film made of indium oxide/tin oxide; Conductive Film, namely, a transparent electric conduction film; ITO Transparent Conductive Film, namely, a transparent electric conduction film made of indium oxide/tin oxide; ITO (Indium- Tin-Oxide) plates, namely, transparent electric conduction plates made of indium oxide/tin oxide; Conductive plates, namely, transparent electric conduction plates; ITO Transparent Conductive plates, namely, transparent electric conduction plates made of indium oxide/tin oxide; blank magnetic tapes; blank magnetic discs; blank magnetic optical disks; blank optical disks; SAW (Surface Acoustic Wave) components, namely, SAW (Surface Acoustic Wave) resonators, SAW (Surface Acoustic Wave) filters for interference suppression of electrical fault clearance for use in the fields of industry of electronics, telecommunications, medical technology, consumer electronics, household appliances, data processing, building services, engineering and traffic engineering; SAW (Surface Acoustic Wave) resonators; duplexers; RF (radio frequency) modules; SAW (surface acoustic wave) modules; SAW (surface acoustic wave) fronted modules; diodes; arrestors, namely, lightning arrestors; surge arrestors; surge voltage arrestors; ceramic electric switching components, ceramic electronic switching components; switching spark gaps, namely, arrangements of two conducting electrodes separated by a gap usually filled with a gas such as air, that is designed to allow an electric spark to pass between the conductors when the voltage difference between the conductors exceeds the gap's breakdown voltage; electric filters for conversion; power capacitors; tantalum chip capacitors; aluminum electrolytic capacitors; inductive ferrite components; film capacitors; polymer chip capacitors; accessories for ferrites for making assemblies holding ferrites, namely, bobbins, springs, yokes, clips, clamps, bands, cases, covers, electrical feed connectors, magnetostrictive vibrators, bias magnets, trimmers and flanges; SMT (surface mount technology) inductive resistors; SMT (surface mount technology) power inductive resistors; repeating electric coils; EMC (electromagnetic compatibility) filters for shielded rooms to suppress electromagnetic interference; EMC (electro magnetic compatibility) feedthrough components, namely, capacitors, inductors and varistors; metal oxide varistors which contain a ceramic mass of zinc oxide grains, in a matrix of other metal oxides (such as small amounts of bismuth, cobalt, manganese) sandwiched between two metal plates (the electrodes); ceramic semiconductors; microwave band pass filters; microwave resonators; dielectric ceramic filters for filtering electrical and/or electronic signals; electric/electronic modules to control high-frequency radio waves; electric/electronic modules to control microwaves; integrated electric and electronic modules utilizing LTCC (low-temperature cofired ceramics) technology; dielectric materials, namely, insulators that do not conduct current; materials for electrodes, all relating to the telecommunications, electrical, engineering, automotive, industrial and consumer electronics industries; BAW (bulk acoustic wave) components, namely, filters, duplexers; FBAR (film bulk acoustic wave) components, namely, bulk acoustic resonators, bulk acoustic filters, bulk acoustic duplexers, bulk acoustic sensors; MEMS (micro electro mechanical systems) components, namely, devices that incorporate multi- layered actuators and sensors on a substrate; MEMS (micro electro mechanical systems) sensors, namely, pressure sensors; electronic circuit modules; H-ML (high-frequency multilayer) devices, namely, components and devices used in high-frequency circuits of communication devices such as cellular telephones; ESD (electro-static discharge) components, namely, electric and electronic components for protecting electronic circuits from ESD (electro static discharge) problems; EMI (electro-magnetic interference) components, namely, choke coils, chip beads, filters, EMI (electro-magnetic interference) filters, clamp filters, line filters, common mode filters; planar lightwave circuits; electronic and optical communications instruments and components, namely, transmitter optical subassemblies (TOSA); electronic and optical communications instruments and components, namely, receiver optical subassemblies (ROSA); optical sensors; visible radiant optical sensors; optical attenuators; optical couplers; electronic and optical communications instruments and components, namely, optical splitters; optical filters; optical switches; electronic and optical communications instruments and components, namely, optical isolators; optical circulators; optical modulators; optical connectors; optical multiplexers; optical demultiplexers; electronic and optical communications instruments and components, namely, optical transceivers; photo diodes; electronic and optical communications instruments and components, namely, optical sensor modules; electronic and optical communications instruments and components, namely, visible radiant optical sensor modules; electronic and optical communications instruments and components, namely, optical attenuator modules; electronic and optical communications instruments and components, namely, optical coupler modules; electronic and optical communications instruments and components, namely, optical splitter modules; electronic and optical communications instruments and components, namely, optical filter modules; electronic and optical communications instruments and components, namely, optical switch modules; electronic and optical communications instruments and components, namely, optical isolator modules; electronic and optical communications instruments and components, namely, optical circulator modules; faraday rotator modules; optical modulator modules; optical connector modules; electronic and optical communications instruments and components, namely, optical multiplexer modules; electronic and optical communications instruments and components, namely, optical demultiplexer modules; electronic and optical communications instruments and components, namely, optical transceiver modules; electronic and optical communications instruments and components, namely, photo diode modules; optical sensor assemblies for optical sensing; visible radiant optical sensor assemblies for optical sensing; electronic and optical communications instruments and components, namely, optical attenuator assemblies; electronic and optical communications instruments and components, namely, optical coupler assemblies; electronic and optical communications instruments and components, namely, optical splitter assemblies; electronic and optical communications instruments and components, namely, optical filter assemblies; electronic and optical communications instruments and components, namely, optical switch assemblies; electronic and optical communications instruments and components, namely, optical isolator assemblies; electronic and optical communications instruments and components, namely, optical circulator assemblies; electronic and optical communications instruments and components, namely, faraday rotator assemblies; electronic and optical communications instruments and components, namely, optical modulator assemblies; electronic and optical communications instruments and components, namely, optical connector assemblies; electronic and optical communications instruments and components, namely, optical multiplexer assemblies; electronic and optical communications instruments and components, namely, optical demultiplexer assemblies; electronic and optical communications instruments and components, namely, optical transceiver assemblies; electronic and optical communications instruments and components, namely, photo diode assemblies; electronic and optical communications instruments and components, namely, transmitter optical sub assemblies; electronic and optical communications instruments and components, namely, receiver optical sub assemblies; faraday rotators; varistors in multilayer form; NTC (negative temperature coefficient) thermistors in multilayer form; Magnetic heads, parts and components, namely, head sliders, head gimbal assemblies (HGA), head arm assemblies (HAA), head stack assemblies (HSA), and/or head coil assemblies (HCA); Magnetic sensors; magnetic encoders for magnetic heads; magnetic scale for magnetic heads; Thin-Film electric Actuators, Thin-Film electronic Actuators; VTR heads for videotape recorders; Tape heads for tape recorders; Finger Navigation module comprised of a lens, sensor and module used for tracking a user's finger movements for the control of electronic devices with touch screens; lightpeak components, namely, optical cables used for data transfer between computers and other devices, connectors therefor, and controller chips; spindle motors for hard disk drives; voice coil motors for hard disk drives; disk drives for computers; electronic integrated circuits; semiconductor chips; semiconductors; MRAM (Magnetoresistive Random Access Memory); biosensor, namely, an analytical device for the detection of an analyte that combines a biological component with a physiochemical detector component; suspensions and parts and components thereof, namely, flexures, load beams, base plates, hinges, and/or traces for hard disk drives; computer disk drive suspensions; magnetic disk drive suspensions; rechargeable batteries; Lithium-ion batteries; rechargeable lithium-ion polymer batteries; parts and fittings for all of the aforesaid goods flip chip mounting machine for the manufacture of electric, electronic and semiconductor devices and components; component inserting machines; motors other than for land vehicles; machines for laser marking, used for the manufacture of electric, electronic and semiconductor devices and components; pumps as parts of machines humidifier for mist generation system nebulizers; nebulizer units; ultrasonic nebulizer units

Class:

Apparatus for lighting

Published for Opposition Date:

08-14-2012

Mark Drawing Status:

Design Only

Business Name:

BAKER & HOSTETLER LLP