By: FLIPCHIP INTERNATIONAL, LLC
associated with 3 other trademarks
custom manufacture of semiconductor wafers and semiconductor chips, namely, application of solder bumps to semiconductor wafers and semiconductor chip...

Words that describe this trademark:

solder bumps  semiconductor wafers  custom manufacture  semiconductor chips  manufacture  application  bumps  chips  wafers 

Serial Number:

75183029

Mark:

Status:

Cancelled-Section 8

Status Date:

07-30-2005

Filing Date:

Registration Number:

2199271

Registration Date:

10-27-1998

Goods and Services:

custom manufacture of semiconductor wafers and semiconductor chips, namely, application of solder bumps to semiconductor wafers and semiconductor chips

Mark Description:

N/A

Class:

Treatment of materials.

Type of Mark:

Servicemark

Published for Opposition Date:

08-04-1998

Owner:

Mark Drawing Status:

2S17

Abandon Date:

N/A

Business Name:

GREENBERG TRAURIG

Correspondent Name:

Recent Trademark filings by this company