associated with 1 other trademarks
SEMICONDUCTOR PACKAGING PRODUCTS, NAMELY, STAMPED AND PLATED LEADFRAMES AND ETCHED LEAD FRAMES; FLEXIBLE INTERCONNECTS, NAMELY, FLEXIBLE CIRCUITS AND ...

Words that describe this trademark:

packaging products  lead frames  semiconductor packaging  plated  flexible  frames  stamped  products  etched  leadframes 

Serial Number:

73496023

Mark:

Status:

Cancelled-Section 8

Status Date:

07-27-1992

Filing Date:

Registration Number:

1374608

Registration Date:

12-10-1985

Goods and Services:

SEMICONDUCTOR PACKAGING PRODUCTS, NAMELY, STAMPED AND PLATED LEADFRAMES AND ETCHED LEAD FRAMES; FLEXIBLE INTERCONNECTS, NAMELY, FLEXIBLE CIRCUITS AND RIGID/FLEX CIRCUITS; ADVANCED PRINTED CIRCUITS, NAMELY, MULTILAYER CIRCUITS, SURFACE MOUNT DEVICE BOARDS AND HEAT SINK CIRCUITS; BACK PLANE AND BUSSING SYSTEMS, NAMELY, BUS BARS AND COMPLIANT PIN CONTACTS, SPECIALTY CIRCUITS, NAMELY, LARGE-SIZE CIRCUITS, MICROWAVE CIRCUITS, AND SPECIALTY METAL CIRCUITS; AND MICROCIRCUITS, NAMELY GATE ARRAYS AND THICK-FILM HYBRID CIRCUITS

Mark Description:

THE MARK COMPRISES A FANCIFUL OVAL DESIGN.

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

10-01-1985

Mark Drawing Status:

2R11

Abandon Date:

N/A

Business Name:

JACOBSON AND JOHNSON

Correspondent Name:

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