Serial Number:
85318229
Mark:
MAXREL
Status:
Abandoned-No Statement of Use filed
Status Date:
03-07-2016
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
Die attach materials and adhesives, namely, metallic, and composite die attach materials and chemicals, chemical fluxes and adhesives used in light emitting diode and organic light emitting diode packaging and assembly, and power driver and control systems for light emitting diode and organic light emitting diode systems; light emitting diode and organic light emitting diode and power driver packaging materials, namely, chemical solder spheres used for chemical and metal based solder bumping, ball grid arrays and interconnect applications for light emitting diode and organic light emitting diode and related power driver and control system device packaging; wafer bumping pastes, hermetic sealing materials, and other metal and polymer-metal composite materials used in light emitting diode wafer bumping and used in hermetically sealing light emitting diode and organic light emitting diode products; electroplating and electroless plating chemicals, namely, copper, tin, nickel, and silver based chemistries including brighteners and levelers, and chemicals for plating on plastics Lead free and tin-lead solder pastes, solder wire, solder preforms made of metal, wave metal solder bar made from such alloys
Mark Description:
N/A
Class:
Common metals and their alloys
Type of Mark:
Trademark
Published for Opposition Date:
12-11-2012
Owner:
Mark Drawing Status:
Standart Character Mark
Abandon Date:
03-07-2016
Business Name:
COWAN LIEBOWITZ & LATMAN P C
Correspondent Name:
