ISOCLAD
associated with 168 other trademarks
Electronic circuit materials, namely, polymer composite laminates and bonding films for use in fabricating recognized printed wiring boards, all being...

Words that describe this trademark:

printed wiring boards  material dielectric  electronic circuit  wiring boards  dielectric substrate  materials  circuit  recognized  boards  fabricating 

Serial Number:

86883411

Mark:

ISOCLAD

Status:

Registered

Status Date:

01-01-2019

Filing Date:

Registration Number:

5643849

Registration Date:

01-01-2019

Goods and Services:

Electronic circuit materials, namely, polymer composite laminates and bonding films for use in fabricating recognized printed wiring boards, all being structural components of the foregoing goods used to fabricate electronic circuits; electronic circuit material, namely, a dielectric substrate clad on one or both sides with a conductive layer for fabricating electronic circuits or unclad for use as a bonding layer, all being structural components of the foregoing goods used to fabricate electronic circuits Electronic circuit material, namely, an insulated dielectric substrate material which is clad on one or both sides with a conductive layer for fabricating electronic circuits; Polymeric materials sold in sheet form, rods, blocks and other stock shapes, for use by third party manufacturers; microwave laminates and bonding films for use in manufacturing electronic circuitry; Fiber Reinforced Plastic Materials in Extruded, Molded and Machined Shapes for Use in Manufacture

Mark Description:

N/A

Class:

Rubber

Type of Mark:

Trademark

Published for Opposition Date:

09-12-2017

Mark Drawing Status:

Standart Character Mark

Abandon Date:

N/A

Business Name:

CANTOR COLBURN LLP

Correspondent Name:

Recent Trademark filings by this company