Serial Number:
73348124
Mark:
INSUL-BOND
Status:
Cancelled-Section 8
Status Date:
08-04-1989
Filing Date:
Registration Number:
1230733
Registration Date:
03-15-1983
Epoxy Adhesives (One-Part & Two Part Curing Systems) Used for Component Attachment, Substrate Mounting & Lid Sealing in Microelectronics
Mark Description:
N/A
Class:
Chemicals
Type of Mark:
Trademark
Published for Opposition Date:
12-21-1982
Mark Drawing Status:
Typed Drawing
Abandon Date:
N/A
Business Name:
N/A
Correspondent Name:
