HYBRIDPACK
associated with 14 other trademarks
Integrated circuit chips, namely, computer chips; semiconductor components, in particular, discrete and integrated semiconductors, discrete and integr...

Words that describe this trademark:

integrated circuit chips  circuit chips  chips semiconductor  computer chips  chips computer  semiconductor components  components  particular  integrated  discrete 

Serial Number:

77235548

Mark:

HYBRIDPACK

Status:

Renewed

Status Date:

05-18-2019

Filing Date:

Registration Number:

3606753

Registration Date:

04-14-2009

Goods and Services:

Integrated circuit chips, namely, computer chips; semiconductor components, in particular, discrete and integrated semiconductors, discrete and integrated semiconductor chips and discrete and integrated semiconductor chip housings; transistors, in particular bipolar transistors, field-effect transistors and power transistors

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

05-27-2008

Mark Drawing Status:

Standart Character Mark

Abandon Date:

N/A

Business Name:

WOMBLE BOND DICKINSON (US) LLP

Correspondent Name:

Recent Trademark filings by this company