FORTIBOND
associated with 58 other trademarks
Printable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die either with flip chip wafer ...

Words that describe this trademark:

wafer bonding  bonding  dispensable  pastes  printable  attachment  pin  transferable 

Serial Number:

85837492

Mark:

FORTIBOND

Status:

Abandoned-No Statement of Use filed

Status Date:

08-06-2018

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Printable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die either with flip chip wafer bumping or wire bonded type, onto a variety of substrates, and hermetic/near hermetic packaging; printable pastes for attachment of semiconductor packages of various types onto a variety of substrates; printable or dispensable or jettable pastes for production of electrical and thermal interconnect lines and patterns circuitry, pads; Printable pastes for via-fill applications; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device Printable or dispensable or jettable inks composed of silver powder mixed with epoxy material all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device; pastes for reflective layer printing or transfer composed of silver powder mixed with epoxy material Transferable semi-finished films for wafer-to-wafer bonding, attachment of semiconductor die either flip chip or wire bonded, onto a variety of substrates, and hermetic/near hermetic packaging; semi-finished films for reflective layer printing or transfer; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device

Mark Description:

N/A

Class:

Rubber

Type of Mark:

Trademark

Published for Opposition Date:

11-10-2015

Mark Drawing Status:

Standart Character Mark

Abandon Date:

08-06-2018

Business Name:

CARMODY TORRANCE SANDAK & HENNESSEY LLP

Correspondent Name:

Recent Trademark filings by this company