FOC FLEX-ON-CAP
By: FLIPCHIP INTERNATIONAL, LLC
associated with 5 other trademarks
semiconductor assembly services for third party manufacturers of integrated circuits, namely, wafer level placement of under bump metalization and sol...

Words that describe this trademark:

third party manufacturers  wafer level  integrated circuits  semiconductor assembly  party manufacturers  placement  manufacturers  assembly  circuits  level 

Serial Number:

78439264

Mark:

FOC FLEX-ON-CAP

Status:

Abandoned-No Statement of Use filed

Status Date:

02-24-2006

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

semiconductor assembly services for third party manufacturers of integrated circuits, namely, wafer level placement of under bump metalization and solder balls onto integrated electrical circuits

Mark Description:

N/A

Class:

Treatment of materials.

Type of Mark:

Servicemark

Published for Opposition Date:

05-31-2005

Owner:

Mark Drawing Status:

Standart Character Mark

Abandon Date:

02-24-2006

Business Name:

GREENBERG TRAURIG LLP

Correspondent Name:

Recent Trademark filings by this company