DAEBOND 3D
By: DAETEC
associated with 0 other trademarks
Adhesive for temporary bonding of electronic substrates to facilitate simple wet bench debonding

Words that describe this trademark:

electronic   wet bench  temporary bonding  adhesive  bench  debonding  substrates  bonding  facilitate  simple 

Serial Number:

86100988

Mark:

DAEBOND 3D

Status:

Abandoned-No Statement of Use filed

Status Date:

01-02-2017

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Adhesive for temporary bonding of electronic substrates to facilitate simple wet bench debonding

Mark Description:

N/A

Class:

Chemicals

Type of Mark:

Trademark

Published for Opposition Date:

04-01-2014

Owner:

Mark Drawing Status:

Standart Character Mark

Abandon Date:

01-02-2017

Business Name:

DAETEC

Correspondent Name:

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