CU.P BOND
By: ADVANPACK SOLUTIONS PTE LTD.
associated with 1 other trademarks
Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; int...

Words that describe this trademark:

integrated circuit semiconductor  flip chip  semiconductor wafer  wafer  interconnect  circuit  extending  chip  conductive 

Serial Number:

76330816

Mark:

CU.P BOND

Status:

Abandoned-Failure to Respond

Status Date:

09-17-2002

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect Manufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services

Mark Description:

N/A

Class:

Treatment of materials.

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Owner:

Mark Drawing Status:

Words, Letters, and/or Numbers in Stylized From

Abandon Date:

07-16-2002

Business Name:

N/A

Correspondent Name:

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