CU-THERM
associated with 3 other trademarks
Thermal interface materials, namely, nanocopper oligomeric adhesive binders and conductive fillers for thermal management, thermal grounding, transfer...

Words that describe this trademark:

thermal interface materials  interface materials  thermal management  conductive fillers  nanocopper  adhesive  oligomeric  binders  materials  fillers 

Serial Number:

88575213

Mark:

CU-THERM

Status:

Abandoned-Failure to Respond

Status Date:

07-01-2020

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Thermal interface materials, namely, nanocopper oligomeric adhesive binders and conductive fillers for thermal management, thermal grounding, transferring and removing heat, connecting electronic materials to thermal ground planes, power supplies, power control and switching, computer applications, graphics processing units, lighting systems, electric switches, power control modules

Mark Description:

N/A

Class:

Rubber

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Mark Drawing Status:

Standart Character Mark

Abandon Date:

05-13-2020

Business Name:

GOODWIN PROCTER LLP

Correspondent Name:

Recent Trademark filings by this company