Serial Number:
75733700
Mark:
COPPER CORE CSP
Status:
Abandoned-Failure to Respond
Status Date:
04-11-2002
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
ELECTRONIC COMPONENTS, NAMELY, SOLDER BUMPED SEMICONDUCTOR SILICON CHIPS AND WAFERS; SOLDER BUMPED ELECTRONIC SUBSTRATES FOR USE IN FURTHER MANUFACTURE OF ELECTRONICS; AND SOLDER BUMPED ELECTRICAL CIRCUIT BOARDS
Mark Description:
N/A
Class:
Scientific
Type of Mark:
Trademark
Published for Opposition Date:
N/A
Owner:
Mark Drawing Status:
Typed Drawing
Abandon Date:
02-25-2002
Business Name:
TUNG & ASSOCIATES
Correspondent Name:
