COOL-LID
associated with 26 other trademarks
Thermally conductive chemical adhesive compounds in both paste and film formats that cure in situ or with heat to form strong bonding between heat gen...

Words that describe this trademark:

adhesive compounds  film formats  chemical adhesive  thermally conductive  paste film  both  conductive  formats  compounds  cure 

Serial Number:

75515056

Mark:

COOL-LID

Status:

Cancelled-Section 8

Status Date:

07-15-2006

Filing Date:

Registration Number:

2283066

Registration Date:

10-05-1999

Goods and Services:

Thermally conductive chemical adhesive compounds in both paste and film formats that cure in situ or with heat to form strong bonding between heat generating devices and heat-sinks or heat-spreaders for use in the power conversion, power supply, motor control, computer and general electronic industries

Mark Description:

N/A

Class:

Chemicals

Type of Mark:

Trademark

Published for Opposition Date:

07-13-1999

Mark Drawing Status:

Typed Drawing

Abandon Date:

N/A

Business Name:

N/A

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