VIA DEP
associated with 78 other trademarks
Chemical used in metallization of circuit boards and integrated chips; direct metallization chemicals for use in high-density printed circuit boards; ...

Words that describe this trademark:

integrated chips  direct metallization  circuit boards  chemical used  chips direct  boards  used  metallization  chemicals 

Serial Number:

97252047

Mark:

VIA DEP

Status:

Registered

Status Date:

09-27-2022

Filing Date:

Registration Number:

6859492

Registration Date:

09-27-2022

Goods and Services:

Chemical used in metallization of circuit boards and integrated chips; direct metallization chemicals for use in high-density printed circuit boards; chemicals used in the manufacture of high density interconnect circuitry; chemicals used in metallization of printed circuit board substrates

Mark Description:

N/A

Class:

Chemicals

Type of Mark:

Trademark

Published for Opposition Date:

07-12-2022

Mark Drawing Status:

Standart Character Mark

Abandon Date:

N/A

Business Name:

CARMODY TORRANCE SANDAK & HENNESSEY LLP

Correspondent Name:

Recent Trademark filings by this company