POWERCSP
associated with 39 other trademarks
Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others Semiconductor packages, name...

Words that describe this trademark:

semiconductor devices  semiconductor packages  packages custom  custom fabrication  devices design  fabrication packaging  design testing  testing semiconductor  packaging assembly  assembly 

Serial Number:

90033663

Mark:

POWERCSP

Status:

Registered

Status Date:

11-15-2022

Filing Date:

Registration Number:

6901768

Registration Date:

11-15-2022

Goods and Services:

Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects Design and testing of semiconductor devices for others

Mark Description:

N/A

Class:

Scientific and technological services

Type of Mark:

Trademark

Published for Opposition Date:

11-24-2020

Mark Drawing Status:

Standart Character Mark

Abandon Date:

N/A

Business Name:

MCANDREWS, HELD & MALLOY, LTD.

Correspondent Name:

Recent Trademark filings by this company