INTEGRATED PACKAGE ON PACKAGE
associated with 39 other trademarks
Semiconductor package modules comprised of semiconductor dies and signal routing structures Custom fabrication, namely, the assembly and encapsulation...

Words that describe this trademark:

signal routing  custom fabrication  package modules  comprised  structures  semiconductor  dies  modules  routing 

Serial Number:

77092585

Mark:

INTEGRATED PACKAGE ON PACKAGE

Status:

Abandoned-Failure to Respond

Status Date:

02-23-2009

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Semiconductor package modules comprised of semiconductor dies and signal routing structures Custom fabrication, namely, the assembly and encapsulation of semiconductor devices for others Design of packaging for semiconductor devices for others, and testing of semiconductor devices

Mark Description:

N/A

Class:

Scientific and technological services

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Mark Drawing Status:

Standart Character Mark

Abandon Date:

12-28-2008

Business Name:

STETINA BRUNDA GARRED & BRUCKER

Correspondent Name:

Recent Trademark filings by this company