FLEXCSP
associated with 39 other trademarks
Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects Custom fabrication of semiconductors and semi...

Words that describe this trademark:

design testing  testing semiconductor  packaging assembly  semiconductor devices  semiconductor packages  packages custom  custom fabrication  devices design  fabrication packaging  assembly 

Serial Number:

90033642

Mark:

FLEXCSP

Status:

Abandoned-Failure to Respond

Status Date:

12-31-2021

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others Design and testing of semiconductor devices for others

Mark Description:

N/A

Class:

Scientific and technological services

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Mark Drawing Status:

Standart Character Mark

Abandon Date:

12-28-2021

Business Name:

MCANDREWS, HELD & MALLOY, LTD.

Correspondent Name:

Recent Trademark filings by this company