EXSILCAP
By: UTILITY DEVELOPMENT CORPORATION
associated with 8 other trademarks
Plastic molding compound for use in the encapsulation of integrated circuits

Words that describe this trademark:

integrated circuits  plastic molding  molding compound  encapsulation  compound  circuits 

Serial Number:

78361619

Mark:

EXSILCAP

Status:

Cancelled-Section 8

Status Date:

11-25-2016

Filing Date:

Registration Number:

3083557

Registration Date:

04-18-2006

Goods and Services:

Plastic molding compound for use in the encapsulation of integrated circuits

Mark Description:

N/A

Class:

Chemicals

Type of Mark:

Trademark

Published for Opposition Date:

11-09-2004

Owner:

Mark Drawing Status:

Standart Character Mark

Abandon Date:

N/A

Business Name:

N/A

Correspondent Name:

Recent Trademark filings by this company