EPAD
By: AMKOR TECHNOLOGY, INC.
associated with 39 other trademarks
PLASTIC INTEGRATED CIRCUIT PACKAGING WHICH INCORPORATES A DIE ATTACH PADDLE WHICH IS DEPRESSED SUCH THAT IT IS FLUSH WITH THE PACKAGE BOTTOM SURFACE F...

Words that describe this trademark:

integrated circuit packaging  die attach  circuit  incorporates  attach  depressed  plastic  flush  paddle  packaging 

Serial Number:

75585555

Mark:

EPAD

Status:

Abandoned-Failure to Respond

Status Date:

11-26-2000

Filing Date:

Registration Number:

N/A

Registration Date:

N/A

Goods and Services:

PLASTIC INTEGRATED CIRCUIT PACKAGING WHICH INCORPORATES A DIE ATTACH PADDLE WHICH IS DEPRESSED SUCH THAT IT IS FLUSH WITH THE PACKAGE BOTTOM SURFACE FOR THERMAL AND ELECTRICAL ENHANCEMENT

Mark Description:

N/A

Class:

Scientific

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Owner:

Mark Drawing Status:

5R05

Abandon Date:

09-14-2000

Business Name:

SKJERVEN MORRILL

Correspondent Name:

Recent Trademark filings by this company